3V to 12V Current-Limiting Hot-Swap Controllers
with Autoretry, DualSpeed/BiLevel Fault Protection
Calculate the MOSFET thermal resistance required
for a short to ground.
Z θ JA = (150°C - 85°C) / (5V ? 10A) = 1.30°C/W
Using t START = 1ms as the pulse duration, use
Figure 17 to select a duty cycle. The duty cycle
should be about 0.01 or less. This implies t RETRY =
t START / 0.01 = 100ms. From Figure 8, C TIM = 10nF.
HIGH-CURRENT PATH
SENSE RESISTOR
MAX4271
Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep
all traces as short as possible and to maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the MAX4271/
MAX4272/MAX4273 close to the card’s connector. Use
a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections (Figure 18).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence,
the power dissipation across the switch increases, as
does the die temperature. An efficient way to achieve
good power dissipation on a surface-mount package is
to lay out two copper pads directly under the MOSFET
package on both sides of the board. Connect the two
pads to the ground plane through vias, and use
enlarged copper mounting pads on the top side of the
board.
MAX4272
MAX4273
Figure 18. Kelvin Connections for the Current-Sense Resistors
Pin Configurations
TOP VIEW
RTH 1
AUXVCC 2
16 OUTC
15 INC
IN 1
8
ON
IN 3
SENSE 4
MAX4273
14 REF
13 ON
SENSE 2
MAX4271
7
STAT
GATE 5
12 STAT
GATE
3
MAX4272
6
CTIM
CEXT 6
11 CTIM
GND 4
5
CSPD
LLMON 7
GND 8
10 CSPD
9
CTON
SO
QSOP/SO
______________________________________________________________________________________
23
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